dual color led lamps LVY9UG42293-PF - 2008 13 - jun. doc. no : qw0905- rev. : date : a data sheet LVY9UG42293-PF lead-free parts pb ligitek electronics co.,ltd. property of ligitek only
18.0min 25% 2.0min 2.54typ note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. -30 75% 100%25% 50% 0 -60 2.54typ directivity radiation 0 ? 0.5 typ 2.0min 2 1 3 30 100% 50%75% -60 1.anode green 2.common cathode 3.anode yellow 1 23 5.2 6.7 0.5 ligitek electronics co.,ltd. property of ligitek only 4.0 3.0 4.2 1.5 max LVY9UG42293-PF package dimensions part no. 9ug vy page 1/6
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. yellow green algainp LVY9UG42293-PF 20 595 water clear 57420 emitted lens 90030 550 2.6 1.7 350 1.72.655030 min. min.max. typ. static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. -30 ~ +100 typical electrical & optical characteristics (ta=25 ) part nomaterial spectral halfwidth nm dominant wave length dnm color * storage temperature tstg viewing angle 2 1/2 (deg) luminous intensity @20ma(mcd) forward voltage @20ma(v) absolute maximum ratings -20 ~ +80 peak forward current duty 1/10@10khz 10 ir reverse current @5v electrostatic discharge( * ) operating temperature 2000 esd t opr power dissipation 75 pd i fp 60 symbol forward current parameter i f 30 vy absolute maximum ratings at ta=25 a 10 v 500 mw 75 60 ma 30 ma 9ug unit ligitek electronics co.,ltd. property of ligitek only page 2/6 LVY9UG42293-PF part no. algainp
3/6 page vy chip typical electro-optical characteristics curve 650 3.0 2.5 1.5 1.0 0.5 0.0 2.0 60100 80 02040 -40-20 0.9 0.8 100 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 600 550 500 1.2 1.1 1.0 60 40 20 0 -20 -40 3.0 2.5 2.0 1.5 1.0 0.5 0.0 1000 100 10 1.0 1000 100 10 1.0 0.1 1.0 ligitek electronics co.,ltd. property of ligitek only r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.2 relative intensity vs. forward current forward current(ma) f o r w a r d c u r r e n t ( m a ) fig.1 forward current vs. forward voltage forward voltage(v) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 ambient temperature( ) fig.4 relative intensity vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 wavelength (nm) r e l a t i v e i n t e n s i t y @ 2 0 m a ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature LVY9UG42293-PF part no.
page 4/6 9ug chip 3.0 100 60 4080 -200 -4020020 3.0 2.5 1.0 0.5 0 650 600 550 2.5 2.0 1.5 1.0 1.1 1.0 1.2 0.9 2.0 1.5 1.0 0.5 0 60100 80 -40-2040 0.8 5.0 4.0 3.0 2.0 500 0.5 0 1000 100 10 1.0 1000 100 10 1.0 0.1 1.0 ligitek electronics co.,ltd. property of ligitek only r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.2 relative intensity vs. forward current forward current(ma) f o r w a r d c u r r e n t ( m a ) fig.1 forward current vs. forward voltage forward voltage(v) typical electro-optical characteristics curve r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 ambient temperature( ) fig.4 relative intensity vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z @ 2 5 wavelength (nm) r e l a t i v e i n t e n s i t y @ 2 0 m a ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature LVY9UG42293-PF part no.
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 120 note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max preheat 0 0 25 2 /sec max 50 time(sec) 100 150 260 temp( c) 5 /sec max 260 c3sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 5/6 LVY9UG42293-PF part no.
the purpose of this test is the resistance of the device under tropical for hours. high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.t.sol=230 5 2.dwell time=5 1sec solderability test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test thermal shock test mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. description ligitek electronics co.,ltd. property of ligitek only 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test operating life test test itemtest condition reliability test: mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard page 6/6 LVY9UG42293-PF part no.
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